STILFOLD Virtual Patent Marking

The following STILFOLD products or technologies are protected by patents. The list that follows is provided with the aim to satisfy the virtual patent marking provisions of Section 16 of the America Invents Act, and to serve as a notice under U.S.C. §287(a). The following list of STILFOLD products or technologies may not be all inclusive, and other STILFOLD products or technologies that are not listed here may be protected by one or more other patents. Pending patent applications are also listed.

Patents in force

Sweden: SE 545 199 C2

Europe (EPO): EP 4 180 205 B1*, EP 4 180 206 B1*, EP 4 180 207 B1*, EP 4 326 455 B1**

USA: US 12,290,934 B2, US 12,115,681 B2

* Geographical coverage:

  • European Patent with Unitary Effect in Austria, Belgium, Bulgaria, Denmark, Estonia, Finland, France, Germany, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Portugal, Slovenia, and Sweden.
  • European Patent validated in Great Britain, Spain and Switzerland.

** Geographical coverage:

  • European Patent with Unitary Effect in Austria, Belgium, Bulgaria, Denmark, Estonia, Finland, France, Germany, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Portugal, Romania, Slovenia, and Sweden.
  • European Patent validated in Great Britain, Spain and Switzerland.

Pending patent applications (Published)

Europe (EPO)_ EP 4 360 817 A1

USA: US 2023/0084080 A1

China: CN 117916032 A, CN 119451758 A

India: IN 202417024623 A, IN 202517004021 A

Canada: CA 3,230,351 A1, CA 3,259,455 A1

Pending patent applications (Not yet published)

Europe (EPO):, EP25190590.7

USA: US 18/876,125, US 19/120,408

Last updated on October 7, 2025.

TRADEMARKS

EU

  • • STILFOLD
  • • STILWARE
  • • STILRIDE

GREAT BRITAIN

  • • STILRIDE

US

  • • STILRIDE

IPR strategy and IP portfolio

Our IP portfolio covers STILFOLD - our manufacturing process - as well as our proprietary tools for forming sheet material, material diagnostics and specific design applications. As welll as our unique know-how and recipe combining computational design, software and advanced material science.

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